Z77 OC Formula finishes Super PI 32M Calculation in 4 minutes 41.641 seconds

January 8, 2013

ASRock Inc. is established in 2002, specialized in the field of motherboards. ASRock strives to build up its own brand. With the 3C design concept, “Creativity, Consideration, Cost-effectiveness”, the company explores the limit of motherboards manufacturing while paying attention on the eco issue at the same time, developing products with the consideration of eco-friendly concept.ASRock has been growing fast and become world third largest motherboard brand with headquarter in Taipei, Taiwan and branches in Europe and the USA. The young and vibrant company targets at entry to mainstream segment MB business, owning reputation around the world market with its reliability and proficiency. Further information, please visit: http://www.asrock.com/.
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ASRock’s award winning, 1st place snatching, record breaking OC Formula has rewritten history once again today by passing Super PI 32M by an unbelievable 4 minutes 41.641 seconds new world record! ASRock OC Formula, which was designed by the maestro of overclocking Nick Shih himself, has already set numerous overclocking records since its launch last year. These great results all indicate that ASRock OC Formula is the ultimate weapon for extreme overclocking.


ASRock's award winning mobo_Z77 OC Formula

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Above: Overclocker SF3D from Finland used an Intel Core i7 3770K processor, ASRock OC Formula and liquid nitrogen to finish Super PI 32M by 4 minutes and 41.641 seconds!(http://hwbot.org/submission/2342548_sf3d_superpi_32m_core_i7_3770k_4min_41sec_641ms)


Z77 OC Formula finishes Super PI 32M Calculation


Above: The Finn overclocker SF3D overclocking an Intel Core i7 3770K CPU to 6.972GHz on ASRock OC Formula, and then sets a new world record by running Super PI 32M calculation by 4 minutes and 41.641 seconds. The amazing score was done by SF3D OC Inflection point CPU pot and SF3D OC Triple point pot.

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ASRock Z77 OC Formula comes with three exclusive Formula kits. The Power Kit provides smooth voltages for the CPU with Digi Power, DSM, PAC, MFC and 12+4 power phase design. The Cooling Kit is composed by a Twin-Power Cooling Heatsink, 8-layer-PCB design with 4 sets of 2oz copper inner layers and GELID Solution GC-Extreme Thermal Compound for extending possibilities. Lastly, the Connector Kit which includes Hi-Density Power Connectors and 15? Gold Fingers promises system stability. Overclocking? You had better choose ASRock OC Formula for the win.

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